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Archive for the ‘transportation’ category: Page 37

Apr 2, 2024

$25,000 Tesla To Ditch Production Line For Radical New Assembly Technique

Posted by in category: transportation

Cars today roll along a production line where components are added at set stations and Tesla now wants to implement a completely new assembly process.

Apr 2, 2024

DARPA Aircraft With No Wing and Tail Control Surfaces Moves Into Design Stage

Posted by in category: transportation

DARPA and Boeing’s Aurora are moving ahead with their research into the creation of an active flow control aircraft with no control surfaces.

Apr 1, 2024

Hydrogen to power Japan’s new passenger jet by 2035

Posted by in categories: economics, energy, transportation

As AFP reports, in a meeting with industry experts, an economy ministry official outlined a target completion date of post-2035. To achieve this ambitious goal, a significant investment of five trillion yen ($33 billion) will be allocated over the next decade, fueling research and development of the new passenger plane.

This latest endeavor seeks to establish Japan as a leader in passenger aircraft production – a position it hasn’t held in over half a century. Building on the challenges that Mitsubishi Heavy Industries (MHI) encountered, which canceled its long-delayed passenger jet project in 2023, the new public-private consortium strongly emphasizes clean energy.

Apr 1, 2024

Nissan and Mitsubishi to Partner on a New EV and Pickup Truck for the U.S.

Posted by in category: transportation

The two brands are already part of an alliance, and now they look to leverage that in pursuit of more success in America.

Apr 1, 2024

Nissan plans 30% cheaper EVs by 2030

Posted by in categories: business, sustainability, transportation

Japanese carmaker Nissan has announced plans to boost its electric vehicle lineup with an additional 34 models, and is aiming for price parity with internal combustion engine (ICE) vehicles by 2030.

This week, at a press conference in Atsugi, near Tokyo, Nissan revealed its medium to longer-term business roadmap. The plans, which cover the period from 2024 to 2030, include a dramatic expansion of vehicle electrification, a significant reduction in costs, and a number of technological innovations.

Apr 1, 2024

Tesla’s new basic Autopilot video tutorial is clear and focused on safety

Posted by in categories: robotics/AI, transportation

Tesla seems to be making some serious headway with its Full Self-Driving (FSD) suite with the release of V12.3. But while FSD is currently the company’s flagship advanced driver-assist system, basic Autopilot still plays a huge role in Tesla’s electric cars. With this in mind, Tesla seems to be doubling down on educating drivers about the proper use of basic Autopilot, as well as the system’s limitations.

As could be seen in the company’s Tesla Tutorials channel on YouTube, the company has released a thorough tutorial focused on basic Autopilot’s features and proper use. The video is over four minutes long, and all throughout its duration, Tesla highlighted that the features of basic Autopilot does not make vehicles autonomous. The company also emphasized that basic Autopilot is designed to work with a fully attentive driver.

The video fully discussed the capabilities and limitations of basic Autopilot’s two main features, Traffic-Aware Cruise Control (TACC) and Autosteer (Beta). The Tesla Tutorial video discussed how to engage both features, how to set their specific parameters, and how they are disengaged. Overall, it is quite encouraging to see Tesla publishing a tutorial that’s purely focused on basic Autopilot.

Apr 1, 2024

Photonics Breakthrough: Tiny Chip Generates High-Quality Microwave Signals

Posted by in categories: robotics/AI, transportation

Researchers create a compact, all-optical device with the lowest microwave noise ever achieved for an integrated chip.

In a new Nature study, Columbia Engineering researchers have built a photonic chip that can produce high-quality, ultra-low-noise microwave signals using only a single laser. The compact device — a chip so small, it could fit on a sharp pencil point — results in the lowest microwave noise ever observed in an integrated photonics platform. The achievement provides a promising pathway towards small-footprint ultra-low-noise microwave generation for applications such as high-speed communication, atomic clocks, and autonomous vehicles.

Mar 29, 2024

Snow, ice disrupt trips home for millions ahead of Chinese New Year

Posted by in category: transportation

BEIJING, Feb 6 (Reuters) — Freezing rain, snow and ice have snarled traffic in central, eastern and southern China as millions of people travel home ahead of the Spring Festival holiday in the blistering cold that has swept through parts of the country over the past week.

Southern Hunan and central Hubei provinces bore the brunt of the severe weather, which deteriorated over the weekend, slowing highway traffic to a crawl, cancelling hundreds of trains and delaying flights.

The disruptions coincide with the biggest mass travel migration in the world as people across the country flock home to see their families for the Chinese New Year holiday, which officially begins on Saturday.

Mar 29, 2024

Neil deGrasse Tyson Explains Dimensions

Posted by in category: transportation

What’s up with the fourth dimension? Neil deGrasse Tyson and Chuck Nice explore the dimensions, worldlines, and what it would mean to be 4D.

Learn about time and space and how we navigate through both. What would a 2D world be like for two-dimensional people? We break down what it’s like for 3D beings to interact with the second dimension and what it would be like for 4D beings to interact with the third dimension. Plus, we discuss flying cars and whether we already have them.

Continue reading “Neil deGrasse Tyson Explains Dimensions” »

Mar 29, 2024

Intel introduces approach to Boost Power Efficiency, Reliability of Packaged Chiplet Ecosystems

Posted by in categories: computing, transportation

The integration of electronic chips in commercial devices has significantly evolved over the past decades, with engineers devising various integration strategies and solutions. Initially, computers contained a central processor or central processing unit (CPU), connected to memory units and other components via traditional communication pathways, known as front-side-bus (FSB) interfaces.

Technological advances, however, have enabled the development of new integrated circuit (IC) architectures relying on multiple chiplets and more sophisticated electronic components. Intel Corporation played a crucial role in these developments, by introducing new architectures and specifications for the design of systems with multiple packaged chiplets.

Researchers at Intel Corporation Santa Clara recently outlined a new vision for further boosting the performance of systems developed following universal chiplet interconnect express (UCIe), a specification to standardize the connections between multi-function chiplets in modern System-in-Package (SiP). Their proposed approach, presented in a paper in Nature Electronics, entails reducing the frequency in these circuits to boost their power efficiency and performance.

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