In future high-tech industries, such as high-speed optical computing for massive AI, quantum cryptographic communication, and ultra-high-resolution augmented reality (AR) displays, nanolasers—which process information using light—are gaining significant attention as core components for next-generation semiconductors.
A research team has proposed a new manufacturing technology capable of high-density placement of nanolasers on semiconductor chips, which process information in spaces thinner than a human hair.
A joint research team led by Professor Ji Tae Kim from the Department of Mechanical Engineering and Professor Junsuk Rho from POSTECH, has developed an ultra-fine 3D printing technology capable of creating “vertical nanolasers,” a key component for ultra-high-density optical integrated circuits.









