Robots are unable to perform everyday manipulation tasks, such as grasping or rearranging objects, with the same dexterity as humans. But Brazilian scientists have moved this research a step further by developing a new system that uses deep learning algorithms to improve a robot’s ability to independently detect how to grasp an object, known as autonomous robotic grasp detection.

In a paper published Feb. 24 in Robotics and Autonomous Systems, a team of engineers from the University of São Paulo addressed existing problems with the visual perception phase that occurs when a robot grasps an object. They created a model using deep learning neural networks that decreased the time a robot needs to process visual data, perceive an object’s location and successfully grasp it.

Deep learning is a subset of machine learning, in which computer algorithms are trained how to learn with data and to improve automatically through experience. Inspired by the structure and function of the human brain, deep learning uses a multilayered structure of algorithms called neural networks, operating much like the human brain in identifying patterns and classifying different types of information. Deep learning models are often based on convolutional neural networks, which specialize in analyzing visual imagery.

Advanced system-on-chip designs are extremely complex in terms of transistor count and are hard to build using the latest fabrication processes. In a bid to make production of next-generation chips economically feasible, chip fabs need to ensure high yields early in their lifecycle by quickly finding and correcting defects.

But finding and fixing defects is not easy today, as traditional optical inspection tools don’t offer sufficiently detailed image resolution, while high-resolution e-beam and multibeam inspection tools are relatively slow. Looking to bridge the gap on inspection costs and time, Applied Materials has been developing a technology called ExtractAI technology, which uses a combination of the company’s latest Enlight optical inspection tool, SEMVision G7 e-beam review system, and deep learning (AI) to quickly find flaws. And surprisingly, this solution has been in use for about a year now.

“Applied’s new playbook for process control combines Big Data and AI to deliver an intelligent and adaptive solution that accelerates our customers’ time to maximum yield,” said Keith Wells, group vice president and general manager, Imaging and Process Control at Applied Materials. “By combining our best-in-class optical inspection and eBeam review technologies, we have created the industry’s only solution with the intelligence to not only detect and classify yield-critical defects but also learn and adapt to process changes in real-time. This unique capability enables chipmakers to ramp new process nodes faster and maintain high capture rates of yield-critical defects over the lifetime of the process.”