The new chip can wire together supercomputers for artificial intelligence networks.
American semiconductor manufacturing company Broadcom Inc. has released a new chip Jericho3-AI, which is being touted by the company as the highest-performance fabric for artificial intelligence (AI) networks. The new chip will wire together supercomputers.
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Jericho3-AI is packed with features like improved load balancing — which ensures maximum network utilization under the highest network loads, congestion-free operation which implies no flow collisions and no jitter, high radix which allows Jericho3-AI to connect to 32,000 GPUs collectively, and Zero-Impact Failover — ensuring sub-10ns automatic path convergence. All of this would lead to cutting down on the job completion times for AI workload.
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