Researchers at KU Leuven and imec have successfully developed a new technique to insulate microchips. The technique uses metal-organic frameworks, a new type of materials consisting of structured nanopores. In the long term, this method can be used for the development of even smaller and more powerful chips that consume less energy. The team has received an ERC Proof of Concept grant to further their research.
Computer chips are getting increasingly smaller. That’s not new: Gordon Moore, one of the founders of chip manufacturer Intel, already predicted it in 1965. Moore’s law states that the number of transistors in a chip, or integrated circuit, doubles about every two years. This prognosis was later adjusted to 18 months, but the theory still stands. Chips are getting smaller and their processing power is increasing. Nowadays, a chip can have over a billion transistors.
But this continued reduction in size also brings with it a number of obstacles. The switches and wires are packed together so tightly that they generate more resistance. This, in turn, causes the chip to consume more energy to send signals. To have a well-functioning chip, you need an insulating substance that separates the wires from each other, and ensures that the electrical signals are not disrupted. However, that’s not an easy thing to achieve at the nanoscale level.
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