UC Berkeley engineers created a “smart cap” using 3-D-printed plastic with embedded electronics to wirelessly monitor the freshness of milk (credit: Photo and schematic by Sung-Yueh Wu)
UC Berkeley engineers, in collaboration with colleagues at Taiwan’s National Chiao Tung University, have developed a 3D printing process for creating basic electronic components, such as resistors, inductors, capacitors, and integrated wireless electrical sensing systems.
As a test, they printed a wireless “smart cap” for a milk carton that detected signs of spoilage using embedded sensors.
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